Passive intermodulation generation by rough conductors
04 Pubblicazione in atti di convegno
Ansuinelli P., Frezza F., Schuchinsky A.
The effect of conductor surface roughness on
electro-thermally (ET) induced passive intermodulation (PIM)
products is analysed and discussed. The analytical model com-
bined with the commercial simulator SIMBEOR is used to
examine the products of ET nonlinearity, which is significantly
influenced by the surface topography of the conductor. It is
further shown that, in spite of the rise of ohmic losses with
frequency, conductor roughness may somewhat allay the ET-
PIM growth due to concurrent increase of additional heat-sinking
provided by the interiors of dendrites and conductor cladding.