micro-XRF

Characterization of printed circuit boards from e-waste byproducts for copper beneficiation

Significant amount of valuable materials are contained in waste from electrical and electronic equipment (WEEE), however they are not easily recovered due to the complexity and heterogeneity of such typology of products. For this reason, a careful recycling-oriented characterization must be the starting point for gathering information about the different elements and materials and their distribution and concentration.

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