Synchrotron

A TM01 mode launcher with quadrupole field components cancellation for high brightness applications

The R&D of high gradient radiofrequency (RF) devices is aimed to develop innovative accelerating structures based on new manufacturing techniques and materials in order to construct devices operating with the highest accelerating gradient. Recent studies have shown a large increase in the maximum sustained RF surface electric fields in copper structures operating at cryogenic temperatures. These novel approaches allow significant performance improvements of RF photoinjectors. Indeed the operation at high surface fields results in considerable increase of electron beam brilliance.

Analysis on the mechanical effects induced by beam impedance heating on the HL-LHC target dump injection segmented (TDIS) absorber

The High Luminosity Large Hadron Collider (HL-LHC) Project at CERN calls for increasing beam brightness and intensity. In such a scenario, critical accelerator devices need to be redesigned and rebuilt. Impedance is among the design drivers, since its thermo-mechanical effects could

Impedance and Instability Studies in LEIR with Xenon

In 2017, the LEIR accelerator has been operated with Xe39+ beam for fixed target experiments in the SPS North Area. The different ion species, with respect to the standard Pb54+, allowed for additional comparative measurements of tune shift versus intensity at injection energy both in coasting and bunched beams. The fast transverse instability observed for high accumulated intensities has been as well characterized and additional observations relevant to impedance have been collected from longitudinal Schottky signal and BTF measurements.

A multi-physics approach to simulate the RF heating 3D power map induced by the proton beam in a beam intercepting device

The project High Luminosity Large Hadron Collider (HL-LHC) calls for a streaking beam intensity and brightness in the LHC machine. In such a scenario, beam-environment electromagnetic interactions are a crucial topic: they could lead to uneven power deposition in machine equipment. The resulting irregular temperature distribution would generate local thermal gradients, this would create mechanical stresses which could lead to cracks and premature failure of accelerator devices. This work presents a method to study this phenomenon by means of coupled electro-thermomechanical simulations.

Design of the new proton synchrotron booster absorber scraper (PSBAS) in the framework of the large hadron collider injection upgrade (LIU) project

The Large Hadron Collider (LHC) Injector Upgrade (LIU) Project at CERN calls for increasing beam intensity for the LHC accelerator chain. Some machine components will not survive the new beam characteristics and need to be rebuilt for the new challenging scenario. This is particularly true for beam intercepting devices (BIDs) such as dumps, collimators, and absorber/scrapers, which are directly exposed

Design of the Target Dump Injection Segmented (TDIS) in the framework of the High Luminosity Large Hadron Collider (HL-LHC) project

The High Luminosity Large Hadron Collider (HL-LHC) Project at CERN calls for increasing beam brightness and intensity. In this scenario, most equipment has to be redesigned and rebuilt. In particular, beam intercepting devices (such as dumps, collimators, absorbers and scrapers) have to withstand impact or scraping of the new intense HL-LHC beams without failure. Furthermore, minimizing the electromagnetic beam-device interactions is also a key design driver since they can lead to beam instabilities and excessive thermo-mechanical loading of devices.

Non-destructive characterization of mechanically processed waste printed circuit boards. Particle liberation analysis

This work aimed to develop and propose methods for evaluating the metal degree of liberation to characterize the metal deportment/concentration and liberation/association of mechanically processed waste Printed Circuit Boards (PCBs) that hold the complex and heterogeneity structure and metal distribution/association. Waste PCBs passed through a series of mechanical processing (i.e.

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