VHDL

Geometry scaling impact on leakage currents in FinFET standard cells based on a logic-level leakage estimation technique

Static power consumption is one of the most critical issues in CMOS digital circuits, and FinFET technology is being recognized as a valid solution for the problem. In this chapter, we utilize a logic-level leakage current estimation technique relying on an internal node voltage-based model. The model is implemented in the form of VHDL packages. By utilizing the capability of the model, the behavior of major leakage component has been analyzed separately for FinFET technology scaling over single- and multi-stage digital standard cells.

LEADER: Leakage currents estimation technique for aging degradation aware 16 nm CMOS circuits

Fast-computable and accurate leakage models for state of the art CMOS digital standard cells is one of the most critical issues in present and future nano-scale technology nodes. It is further interesting if such model can calculate leakage currents not only at initial circuit life but also over the years based on Bias Temperature Instability (BTI) aging mechanism, which increases the threshold voltage over the years – thus mitigating leakage – but in turn degrades circuit speed.

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