Unlike most forms of microscopy, XRM can deliver high resolution and contrast in three dimensions, and can do so without destroying samples. Recent advances in XRM technology have come from pioneering work in synchrotron facilities across the world. In these facilities, researchers use brilliant beams of X-rays produced by particle accelerators to achieve unprecedented levels of resolution and contrast.
The developments in detector and focusing optictechnologies have made possibile the realization and commercialization of lab-based X-ray microscopes (XRM) systems, that can be used to non-destructively characterize the 3D microstructure of materials in controlled environments (in situ) as well as toobserve the evolution of structures over time (4D).
ZEISS Xradia 600-series Versa goes beyond the limits of projection-based micro-and nano-computed tomography (CT) systems. Whereas traditional CT systems rely on single-stage geo-metric magnification, Xradia Versa features a combination of unique two-stage magnification optics and a high flux X-ray source to produce faster sub-micron scale resolution images across the widest range of intact sample sizes and types. The Resolution at a Distance (RaaD) architecture enables high resolution 3D imaging of larger, denser objects including intact components and devices. The flat panel extension (FPX) enables rapid scans of very large samples (up to 25 kg), providing navigation to interior regions of interest.
By leveraging RaaD capability, Xradia Versa maintains the highest resolution across large working distances, accommodating samples contained within environmental chambers and high-precision in situ load rigs. Xradia Versa seamlessly integrates with other ZEISS microscopes to solve your multi-scale correlative challenges. Unlike traditional microCT systems, Xradia Versa family is built on an established ZEISS 3D X-ray microscope platform that is upgradeable, expandable and reliable, paving the way for future enhancements and protecting your investment.
The two major challenges in X-ray computed tomography are maintaining resolution on larger sample sizes and longer working distances while simultaneously maximizing resolution and X-ray flux for greater throughput. The XRM ZEISS Xradia 600-series Versa integrates dual-stage magnification architecture with high flux X-ray source technology. ZEISS specifies XRM on true spatial resolution, which is the most meaningful measurement of a microscope‘s performance. Spatial resolution refers to the minimum separation at which a feature pair can be resolved by an imaging system.ZEISS Xradia Versa obtains true spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm.
The main features of the XRM platform can be summarized as it follows:
- Non-destructive sub-micron scale microscopy of intact samples
- Higher flux and faster scans without compromising resolution
- True spatial resolution of 500 nm with a minimum achievable voxel size of 40 nm
- High resolution across a broad range of sample types, sizes, and working distances
- In situ imaging for non-destructive characterization of microstructures in controlled environments and over time
- Upgradeable and extendible with future innovations and developments
- Throughput with image quality
The main fields of applications, with corresponding tasks and applications, are:
Electronics and Semiconductor Packaging
- Perform structural and failure analysis for process development, yield improvement and construction analysis of advanced semiconductor packages, including 2.5/3D and fan-out packages
- Analyze printed circuit boards for reverse engineering and hardware security
- Non-destructively image across length scales from module to package to interconnect for submicron-resolution characterization of defects at speeds that can complement physical cross-sectioning
- Enable better understanding of defect locations and distributions by viewing unlimited virtual cross-section and plan-view images from all desired angles
- Detailed shape, size, and volume distribution analysis of particles in Additive Manufacturing (AM) powder bed to determine proper process parameters
- High-resolution, non-destructive imaging for microstructural analysis of AM parts
- 3D imaging for comparison with the nominal CAD representation
- Detection of unmelted particles, high-Z inclusions, and voids
- Surface roughness analysis of inner structures that cannot be accessed by other methods
- 3D imaging of biological samples in their natural surroundings
- Imaging of plant roots still embedded in their original soil without any special sample preparation
- Imaging of fragile animals and plants without any sample preparation and sectioning
- Sub-micron imaging of solid structures like seeds as a whole
- Perform multiscale pore structural and fluid flow analysis
- Directly measure fluid flow at the pore scale using in situ flow equipment
- Analyze crystal structures using LabDCT
- Particle analysis with full 3D reconstruction
- Advance mining processes: analyze tailings to maximize mining efforts; conduct thermodynamic leaching studies; perform QA/QC analysis of mining products such as iron ore pellets
- Understand grain orientations in steel and other metals
- Characterize three-dimensional structure
- Observe failure mechanisms, degradation phenomena, and internal defects
- Investigate properties at multiple length scales
- Quantify microstructural evolution
- Perform in situ and 4D (time dependent studies) to understand the impact of heating, cooling, desiccation, wetting, tension, compression, imbibition, drainage and other simulated environmental studies
- Recipe development and supply chain control: Inspection of intact samples for effective supplier control, revealing changes in recipe or cost savings that may affect performance or longevity
- Safety and quality inspection: Identification of debris, particle formation, burrs at the electrical contact or damage to the polymer separator
- Lifetime and aging effect: Longitudinal studies of aging effects
| cognome | nome | |
|---|---|---|
Rossi | Marco |
| data |
|---|
28/11/2020 |
| anno |
|---|
2020 |