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mariapia.desole@uniroma1.it
Maria Pia Desole
Assegnista di ricerca
Struttura:
DIPARTIMENTO DI INGEGNERIA MECCANICA E AEROSPAZIALE
E-mail:
mariapia.desole@uniroma1.it
Pagina istituzionale corsi di laurea
Curriculum Sapienza
Pubblicazioni
Titolo
Pubblicato in
Anno
Life cycle assessment of secondary packaging: Expanded polystyrene versus bioplastic-coated corrugated cardboard
SUSTAINABLE PRODUCTION AND CONSUMPTION
2024
Study and Design of Corrugated Cardboard Trays With Microwaves by Experimental Analysis (EA) and Finite Element Methods (FEM)
PACKAGING TECHNOLOGY AND SCIENCE
2024
Experimental Analysis (EA) and Finite Element Modeling (FEM) of standard, micro-wave and double-wave corrugated cardboard structures for the manufacturing of food packaging
THE INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
2023
Energy absorbing 4D printed meta-sandwich structures: load cycles and shape recovery
INTERNATIONAL JOURNAL, ADVANCED MANUFACTURING TECHNOLOGY
2023
Life Cycle Assessment (LCA) of ceramic sanitaryware: focus on the production process and analysis of scenario
INTERNATIONAL JOURNAL OF ENVIRONMENTAL SCIENCE AND TECHNOLOGY
2023
Experimental analysis of FDM structures in shape memory polylactic acid
Italian Manufacturing Association Conference - XVI AITeM
2023
Life cycle assessment (LCA) of PET and PLA bottles for the packaging of fresh pasteurised milk. The role of the manufacturing process and the disposal scenario
PACKAGING TECHNOLOGY AND SCIENCE
2022
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